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mps2r11 - 608 datasheet 100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 2 microsemi makes no warranty, representation, or guarantee reg arding the information contained herein or the suitability of it s products and services for any particular purpose, nor does microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. the products sold hereunder and any other produc ts sold by microsemi have been subject to limi ted testing and should not be used in conjunction with mission - critical equipment or applications . any performance specifications are believed to be reliable but are not verified, and buyer mus t conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end - products. buyer shall not rely on an y data and performance specifications or parameters provided by microsemi. it is the buyers responsibilit y to independently determine suitability of any products and to test and verify the same. the information provided by microsemi hereunder i s provided as is, where is and with all faults, and the entire risk associated with such information is entirely with the b uyer. microsemi does not grant, explicitly or implicitly, to an y party any patent rights, licenses, or any other ip rights, whether wi th regar d to such information itself or anything described by such information. information provided in this document is proprietary to microsemi, and microsemi reserves the right to make any changes to the information in this document or to any products and servi ces at any time without notice. about microsemi microsemi corporation (nasdaq: mscc) offers a comprehensive por tfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. products incl ude high - performance and radiation - hardened analog mixed - signal integrated circuits, fpgas, socs and asics; power management produc ts; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processin g devices; rf so lutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti - tamper products; ethernet solutions; power - over - ethernet ics and midspans; as well as custom design capabilities and services. mic rosemi i s headquartered in aliso viejo, calif., and has approximately 4,800 employees globally. learn more at www.microsemi.com . ?2016 microsemi corporation. all rights reserved. microsemi and the microsemi logo are regist ered trademarks of microsemi corporation. all other trademarks and service marks are the pr operty of their respective owners. microsemi corporate headquarters one enterprise, aliso viejo, ca 92656 usa within the usa: +1 (800) 713 - 4113 outside the usa: +1 (949) 380 - 6100 sales: +1 (949) 380 - 6136 fax: +1 (949) 215 - 4996 e- mail: sales.support@microsemi.com www.microsemi.com downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 3 1 revision history 1.1 revision 1.0 revision 1.0 was the first publication of this document. downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 4 contents 1 revision history ........................................................................................................................ 3 1.1 revision 1.0 ................................................................................................................................................ 3 2 product overview .................................................................................................................... 7 2.1 applications ............................................................................................................................................... 7 2.1.1 key features ................................................................................................................................ 7 3 electrical specifications ............................................................................................................ 8 3.1 absolute maximum ratings ....................................................................................................................... 8 3.2 typical electrical performance (32 v control) ............................................................................................ 8 3. 3 typical electrical performance (5 v control) .............................................................................................. 9 3.4 small signal swept measurements ............................................................................................................ 9 4 schematic ............................................................................................................................... 11 5 package out line ...................................................................................................................... 12 5.1 backside solder pad dimensions ............................................................................................................. 13 6 installation and handling ....................................................................................................... 14 6.1 manual handling and installation ............................................................................................................ 14 7 evaluation board assembly .................................................................................................... 16 8 tape and reel format ............................................................................................................ 17 downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 5 list of figures figure 1 mps2r11 - 608 ................................................................................................................................................. 7 figure 2 small signal swept measurements ................................................................................................................ 9 figure 3 switching controls signals application ........................................................................................................ 11 figure 4 mps2r11 - 608 package outline .................................................................................................................... 12 figure 5 backside solder pad dimensions ................................................................................................................. 13 figure 6 evaluation board assembly .......................................................................................................................... 16 figure 7 tape and reel format diagrams .................................................................................................................. 17 downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 6 list of tables table 1 absolute maximum ratings ............................................................................................................................ 8 table 2 typical electrical performance (32 v control) ................................................................................................ . 8 table 3 typical electrical performance (5 v control) ................................................................................................... 9 table 4 typical bias element values for switching controls ...................................................................................... 11 table 5 mps2r11 - 608 package dimensions .............................................................................................................. 12 table 6 evaluation board assembly information ....................................................................................................... 16 downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 7 2 product overview the mps2r11 - 608 is a medium - power m onolithic m icrowave surface m ount (mmsm) se ries - shunt pi n diode sp 2 t reflective switch. the technology is a packaged/device integration a ccomplished at the wafer level. thermal transfer is optimized by the elimination of the traditional package interface. the mps2r11 - 608 is completely compatible with pick - and - place and solder - reflow manufacturing techniques. this series of diodes meets rohs requirements according to eu directive 2002/95/ec. the standard terminal finish is gold unless otherwise specified. please co ntact your microsemi representative if you have special requirements. the mps2r11 - 608 is an esd hbm class 1b with a moisture sensitivity rating of msl 2. figure 1 mps2r11- 608 2.1 applications the mps2r11 - 608 is optimized for uhf through c band power and t/r switching applications. the mps2r11 - 608 can handle up to 1 w of input power with as little as 5 v of contr ol bias . 2.1.1 key features the following are the key features of the mps 2r11 - 60 8: ? series - shunt pin diode sp2t ? 40 w cw power ha ndling ( o n state) ? low insertion loss ? high isolation ? surface mount ? 0907 device size ? stable, low-l eakage p assivation with r ugged g lass b ody ? rohs c ompliant 1 ? high - power switching ? surface - mountable ? compact size (65 mils 85 mils) 1. these devices are supplied with gold - plated terminations. consult factory for details. downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 8 3 electrical specifications 3.1 absolute maximum ratings the following table shows the absolute maximum ratings at 25 c unless otherwise specified. table 1 absolute maximum ra tings rating symbol value unit storage t emperature t st C 65 to 150 c operating t emperature t op C 65 to 125 c cw rf o perating p ower p cw 40 w maximum d issipated p ower p diss 4 w forward dc c urrent i f 200 ma reverse dc v oltage v r 150 v esd hbm class 1b moisture sensitivity level msl 2 3.2 typical electrical performance (32 v control) the following table shows the typical electrical performance for 3 2 v control. table 2 typical electrical performance (32 v control) parameter frequency (mhz) bias condition min typ max maximum cw rf input p ower 2 all 40 w insertion l oss 100 C32 v, C100 ma 0 .13 db 0 .18 db 1000 C32 v, C100 ma 0 .19 db 0 .23 db 3000 C32 v, C100 ma 0 .28 db 0 .32 db 6000 C32 v, C100 ma 0 .31 db 0 .38 db 8000 C32 v, C100 ma 0 .75 db 0 .90 db re turn l oss 100 C32 v, C100 ma 34 db 36 db 1000 C32 v, C100 ma 17 db 18 db 3000 C32 v, C100 ma 19 db 20 db 6000 C32 v, C100 ma 14 db 16 db 8000 C32 v, C100 ma 10 db 11 db isolation 100 C32 v, C100 ma 68 db 77 db 1000 C32 v, C100 ma 66 db 72 db 3000 C32 v, C100 ma 50 db 53 db 6000 C32 v, C100 ma 40 db 43 db 8000 38 db 40 db switching s peed 500 ns 2. m aximum input power is defined as less than 1 db compression . downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 9 3.3 typical electrical performance ( 5 v control) the following table shows the typical electrical performance for 5 v control . table 3 typical electrical performance (5 v control) parameter frequency (mhz) bias condition min typ max maximum cw rf input power 3 all 1.0 w insertion loss 100 C5 v, C100 ma 0 .13 db 0 .15 db 1000 C5 v, C100 ma 0 .23 db 0 .25 db 3000 C5 v, C100 ma 0 .35 db 0 .4 db 6000 C5 v, C100 ma 0 .42 db 0 .5 db 8000 C5 v, C100 ma 0 .9 db 1.1 db return loss 100 C5 v, C100 ma 34 db 36 db 1000 C5 v, C100 ma 17 db 18 db 3000 C5 v, C100 ma 18 db 19 db 6000 C5 v, C100 ma 14 db 15 db 8000 C5 v, C100 ma 10 db 11 db isolation 100 C5 v, C 200 ma 68 db 77 db 1000 C5 v, C 200 ma 66 db 72 db 3000 C5 v, C 200 ma 50 db 53 db 6000 C5 v, C 200 ma 40 db 43 db 8000 C5 v, C100 ma 38 db 40 db switching speed 500 ns 3. m aximum input power is defined as less than 1 db compression . 3.4 small signal swept measurements the following illustrations show the small signal swept measurements where t he bias voltage is limited by test equipment (characteristics at nominal bias equivalent or better). figure 2 small signal swept measurements -150.00 -100.00 -50.00 0.00 0.00 2.00 4.00 6.00 8.00 10.00 12.00 isolation (db) frequency (ghz) mps2r11- 608 30 v isolation downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 10 -2.00 -1.50 -1.00 -0.50 0.00 0.00 2.00 4.00 6.00 8.00 10.00 12.00 insertion loss (db) frequency (ghz) mps2r11- 608 30 v insertion loss -40.00 -30.00 -20.00 -10.00 0.00 0.00 2.00 4.00 6.00 8.00 10.00 12.00 input match (db) frequnecy (ghz) mps2r11- 608 30 v return loss downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 11 4 schematic the following illustration shows how the switching controls signals were appl ied. figure 3 switching controls signals application MPS2R11-608 bias 1 bias 2 rf in port 2 port 1 d1 d2 d3 d4 l1 c2 c3 l2 l3 c5 c4 c1 the following table shows the t ypical b ias e lement v alues for s witching c ontrols. table 4 typical bias element values for switching c ontrol s band c1, c3,c5 c2, c 4 l1, l2, l3 vhf (100 mhz C 300 mhz) 150 pf 200 pf 400 nh uhf (300 mhz C 3000 mhz) 40 pf 50 pf 90 nh c band (4.0 ghz C 8.0 ghz) 20 pf 50 pf 20 nh ism (902 mhz C 928 mhz) 15 pf 50 pf 40 nh downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 12 5 package outline the following illustration shows the package outline of the mps 2r11 - 60 8 device . figure 4 mps2r11- 608 package outline the mps2r11 - 608 device has the following package outline dimensions . table 5 mps2r11- 608 package dimensions dim inches millimeters min typ max min typ max a 0.076 0.080 0.084 1.930 2.032 2.134 b 0.056 0.060 0.064 1.422 1.524 1.626 c 0.016 0.406 d 0.020 0.508 e 0.010 0.254 f 0.011 0.279 g 0.047 1.194 h 0.057 1.448 j 0.068 1.727 downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 13 5.1 backside solder pad dimensions the following illustration shows the backside solder pad dimensions of t he mps2r11 - 608 device (units are in inches) . figure 5 backside solder pad dimensions downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 14 6 installation and handling mmsm p roducts are compatible with both solder and silver epoxy paste assemb ly processes. this includes rohs solder. reflow temperatures for rohs solders such as sac sn/ag/cu are higher than traditional pb/sn solders, so extra care must be taken when employing rohs - compatible solders. silver epoxy paste is recommended for applications where power dissip ation is minimal, s uch as tuning varactor /schottky and low - power p in diode applications. for applications with incident power levels greater than 30 dbm, solder attachment is strongly recommended. additionally , as with all microelectronic component assembly, care should be taken t o e nsure that all circuit boards are clean and free from contamination prior to any such operation. this section outlines the considerations for manual and automated assemb ly techniques utilizing either solder or silver epoxy paste. 6.1 manual handling and installation solder assembly mmsm produc ts are designed to be compatible with modern automatic pick - and - place equipment , and are available in tape and reel format as well as in gel and waffle packs. because of the nomina l size of the units , some care must be taken to avoid causing damage during installation. although storage temperature ratings (non - operating) are compatible and equivalent to ratings for standard plastic encapsulated lead - frame commercial packages ( C 55 c to 125 c), temperatures during solder installation can exceed this maximum value. it is critical, therefore, as with any other microelectronic part, to minimize thermal gradients across the dev ice. for example, during manual installation, typical electronic pencil soldering tips can exceed 375 c. when devices are first soldered down to the circuit board on one end only, followed in turn by soldering the opposite end, the original end provides a path to thermal ground. unlike a thermal shock test, in which both package ends are simultaneously exposed to the same temperatures, a s evere thermal gradient may be created during solder iron manual installation. specifically, if the original soldered end rests at room temperature, soldering of the second end ( tip temperature = 375 c ) may create a temperature gradient across the device o f 350 c. use of a soldering iron tip, therefore, is strongly discouraged. if a tip must be used, the following recommendations w ill help minimize the risk of damage: ? limit the tip temperature to the lowest possible temperature appro priate to exceed the li quidus point for the solder being used. ? use the smallest tip mass available to reduce the tip thermal mass rela tive to the device length. ? preheat the circuit board to 100 cC 120 c to further reduce the temperature gradient. following these recommendations will help ensure that thermal differentials are minimized to lower levels. silver paste assembly installation of mmsm product s using s ilver epoxy paste is fairly straight forward. operators familiar with silver epoxy component assembly can easily adapt the ir technique to handle mmsm installation. epotek h20e or equivalent can be used for installation. it is critical that the paste is within the manufacture r s guidelines for shelf life and pot life. see solder pad outline for information on where to dispense and place epoxy. the dots should be approximately 10 mils in diameter. using tweezers or a vacuum pe ncil, the mmsm is placed on the downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 15 epoxy dots and lightly pressed into place. excessive epoxy can cause brid ging b etween the solder pads , which can potentially short out the device. too little epoxy can result in poor electrical or mechanical connection. after installation of the mmsm parts, it is necessary to cure the assembly using the manufacture r s recommended tim e and temperature settings. improper curing can result in poor mechanical bonds as well as reduced electrical performance. for additional installation guidance, consult micronote716 at www.microsemi.com . downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 16 7 evaluation board a ssembly the following illustration show s the evaluation board assembly for the mps 2r11 - 60 8 device. all measurements shown are in inches. the evaluation board has a full - metal backside and the solder mask is topside only. figure 6 evaluation board assembly the following table shows additional evaluation board assembly information for the mps2r11 - 608 device. table 6 evaluation board assembly information ordering part number mstf0011 material 0.016 rogers 4003, 0.5 oz. copper cladding on both sides (starting thic kness) finish e lectroless nickel immersion gold (enig), both sides downloaded from: http:///
100 mhz C 6 ghz 40 w rohs - compliant monolithic spdt pin switch mps2r11 - 608 datasheet 1.0 17 8 tape and reel format the following illustration show s the tape and reel format for the mps 2r11 - 608 device. figure 7 tape and reel format diagrams downloaded from: http:///

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